High Reliability Processing and Selection Guide
High Reliability Processing
Quality Conformance Testing
100% Screening Options
BS9400 Detail Specification Requirements
100% Processing
Group A Electrical Tests
Group B Tests
Group C Periodic Tests
Group D Periodic Testing
Quality Assessment Categories
Selection Guide
Ordering Information
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Isocom Ltd's high reliability processing is based upon BS9000 or CECC20000 test methods, and consists of:
- 100% internal visual inspection (cond. B) - [L2, L3, B, C only]
- 100% isolation leakage current testing
- 100% testing at -55°C and +125°C
- 100% one week burn in [L2, L4, B, D only]
- 100% hermeticity testing [L2, L4, B, C only]
- Group A and B lot-by-lot tests on samples drawn from each inspection lot
- Group C and D periodic tests on samples drawn every 3 and 6 months
Isocom Ltd products are assembled under clean room conditions. All processing and testing is strictly controlled as part of an integrated QA programme.
The following tables summarise the main test requirements for Isocom Ltd's BS9400 and CECC20000 released product. The tables are for guidance only, and specific test requirements are contained in the BS9400/CECC20000 detail specifications, which can be obtained from Isocom Ltd. Comparisons between BS9000, CECC and MIL-STD-883C are also for guidance only, as detail differences do exist between some of the cross referenced test methods.
(Provisional information for CECC 20000)
TESTING
METHOD |
BS9400/ L2
CECC20000/B |
BS9400/L3
CECC20000/C |
BS9400/L4
CECC20000/D |
UNSCREENED |
| PRE-CAP INSPECTION |
Y |
Y |
- |
- |
| PRODUCTION TEST |
Y |
Y |
Y |
Y |
| STABILISATION BAKE |
Y |
Y |
- |
- |
| RAPID CHANGE OF TEMPERATURE |
Y |
Y |
- |
- |
| CONSTANT ACCELERATION |
Y |
Y |
- |
- |
| HERMETICITY TEST |
Y |
Y |
- |
- |
| PRE-BURN IN TEST |
Y |
- |
Y |
- |
| 168h BURN IN |
Y |
- |
Y |
- |
| POST-BURN IN TEST |
Y |
- |
Y |
- |
| FINAL ELECTRICAL TEST |
Y |
Y |
Y |
- |
| GROUP A,B,C,D SAMPLES |
Y |
Y |
Y |
Y |
| BONDED STORE |
Y |
Y |
Y |
Y |
| RELEASE |
Y |
Y |
Y |
Y |
(Sub-Group AOa and AOc)
| TEST |
BS9400 para
(or DS - as detail spec) |
Comparable Test Methods |
CONDITIONS |
CECC20000
Clause |
MIL-STD-
883C Method |
| Int. Visual |
1.2.10/B |
N/A |
2017/B |
|
| Stab. Bake |
1.2.6.3 |
4.4.1 |
1008/C |
24h (min) @ 150°C |
| Temp. Cycle |
1.2.6.13 |
4.4.4 |
1010/C |
-65°C/+150°C, 10 cycles |
| Const. Acceleration |
1.2.6.9 |
4.4.11 |
2001/A |
49000 m/s2 (5000g), Y1 axis, 1 minute |
| Fine Leak |
1.2.6.14 (Qk) |
4.4.10 (Qk) |
1014/A |
Tracer Gas (Helium) Method |
| Gross Leak |
1.2.6.14 (Qc) |
4.4.10 (Qc) |
1014/C |
Fluorocarbon "Bubble" Method |
| Pre-Burn-in Electrical |
DS |
- |
- |
Static Characteristics (except IIO) |
| Burn-in |
1.2.9.2 |
4.5 |
1015/B |
160h (min) @ 125°C |
| Post-Burn-in Electrical |
DS |
- |
- |
Static characteristics (except IIO) |
| PDA Calc |
1.2.9.1 |
- |
- |
5% PDA |
| Final Electrical Tests |
DS |
- |
- |
Static Characteristics @ -55°C, 25°C, 125°C
Switching/Propagation Delay Time Tests @ 25°C |
| External Visual |
1.2.2 |
4.2.1 |
2009 |
|
(Non-destructive, lot-by-lot)
SUB-
GROUP |
TEST |
BS9400 para
(or DS - as detail spec) |
Comparable Test Methods |
TAMB |
SAMPLE |
CECC20000
Clause |
MIL-STD-
883C Method |
I.L. |
A.Q.L. |
| AO(b) |
Input-Output Isolation Leakage Current |
2013 |
- |
- |
25°C |
100% |
| AO(c) |
Operation at Tamb (max); (L2, L3, L4 only) |
DS |
- |
- |
125°C |
| Operation at Tamb (min); (L2, L3, L4 only) |
-55°C |
| A1 |
Visual Inspection |
1.2.1 |
4.2.1 |
2009 |
25°C |
II |
0.25% |
| Statistic Characteristics |
DS |
- |
- |
| A2 |
Inoperatives |
DS |
- |
- |
25°C |
| A3a |
Propagation Delay Times |
DS |
- |
- |
25°C |
II |
0.25% |
| A3b |
Common Mode Transient Immunity (if applicable) |
DS |
- |
- |
25°C |
S4 |
1.5% |
| A4a |
Static Characteristics at Tamb (max) |
DS |
- |
- |
125°C |
S4 |
0.25% |
| A4b |
Propagation Delay Times at Tamb (max) |
DS |
- |
- |
125°C |
| A4c |
Static Characteristics at Tamb (min) |
DS |
- |
- |
-55°C |
| A4d |
Propagation Delay Times at Tamb (min) |
DS |
- |
- |
-55°C |
(Non-destructive, lot-by-lot)
SUB-
GROUP |
TEST |
BS9400 para
(or DS - as detail spec) |
Comparable Test Methods |
CONDITIONS |
SAMPLE |
CECC20000
Clause |
MIL-STD-
883C Method |
I.L. |
A.Q.L. |
| B1 |
Dimensions |
1.2.3 |
4.2.2 |
2016 |
- |
S2 |
6.5 |
| B2 |
Solderability |
1.2.6.15.1 |
4.4.7(1) |
2003 |
Solder Bath Method |
S4 |
4.0 |
| B4a(D) |
Resistance to Solvents |
DS |
- |
2015 |
- |
S2 |
2.5 |
| B3a |
Rapid Change of Temperature |
1.2.6.13 |
4.4.4 |
1010/C |
-65°C/+150°C, 5 Cycles |
S4 |
4.0 |
| Fine Leak Test |
1.2.6.14 (Qk) |
4.4.10 (Qk) |
1014/A |
Tracer Gas (Helium) |
| Gross Leak Test |
1.2.6.14 (Qc) |
4.4.10 (Qc) |
1014/C |
Fluorocarbon Bubble |
| B3b(D) |
Robustness of Terminations |
1.2.6.16.3 |
4.4.9 |
- |
Bending-Row of Terminations |
S2 |
4.0 |
| B3c |
Acceleration, Steady State |
1.2.6.9 |
4.4.11 |
2001/A |
49000 m/s2/Y1/1 Minute |
S4 |
4.0 |
| B3d |
Electrical Endurance |
1.2.7.2 |
- |
- |
160h @ +125°C |
S4 |
1.5 |
| B4(b) |
Bond Strength |
DS |
- |
2011/D |
Internal Wire Pull, performed prior to Lid Seal |
S2 |
1.5 |
|
Post Test End, Points for S/G's B3a, B3c, B3d |
- |
- |
- |
As AOb and A1 |
- |
- |
(3 Monthly Intervals)
SUB-
GROUP |
TEST |
BS9400 para
(or DS - as detail spec) |
Comparable Test Methods |
CONDITIONS |
SAMPLE |
CECC20000
Clause |
MIL-STD-
883C Method |
I.L. |
A.Q.L. |
| C1 |
Electrical Endurance |
1.2.7.2 |
4.5 |
1005/B |
Tamb=125°C, Duration 1000h |
S2 |
1.0 |
| C2a |
Dimensions |
1.2.3 |
4.2.2 |
2016 |
- |
6.5 |
| C2b |
Immersion in Cleaning Solvents |
1.2.6.18 |
- |
- |
- |
| C2c |
Vibration, Sinusoidal |
1.2.6.8.1 |
4.4.6 |
2007/A |
100Hz-2000Hz, 196m/s2, 15 Cycles in each Axis; 14700m/s2, 0.5ms Pulse, 5 Blows in each direction |
| Mechanical Shock |
1.2.6.6 |
4.4.5 |
2002/B |
| Fine and Gross Leak Tests |
1.2.6.14 |
4.4.10 |
1014/A & /C |
| C3 |
Damp Heat, Steady State |
1.2.6.4 |
4.4.3 |
- |
56 Days, No Loading |
|
Post-Test End Points for S/G's C1, C2c, C3 |
- |
- |
- |
As AOb and A1 |
- |
- |
(6 Monthly Intervals)
SUB-
GROUP |
TEST |
BS9400 para
(or DS - as detail spec) |
Comparable Test Methods |
CONDITIONS |
SAMPLE |
CECC20000
Clause |
MIL-STD-
883C Method |
n |
c |
| D1 |
Dimensions |
1.2.3 |
4.2.2 |
2016 |
- |
15 |
0 |
| D2a(D) |
Lead Integrity |
DS |
- |
2004/B2 |
Bending Stress Test |
25 |
1 |
| D2b(D) |
Adhesion of Lead Finish |
DS |
- |
2025 |
- |
| D3a(D) |
Thermal Shock |
1.2.6.19 |
|
1011/B |
-55°C/+125°C, 15 Cycles (Test Nc) |
| Temperature Cycling |
1.2.6.13 |
4.4.4 |
1010/C |
-65°C/+150°C, 100 Cycles |
| Moisture Resistance |
DS |
- |
1004 |
|
| Fine and Gross Leak |
1.2.6.14 |
4.4.10 |
1014/A & B |
| Visual Inspection |
DS |
|
|
| D3b(D) |
Mechanical Shock |
1.2.6.6 |
4.4.5 |
2002/B |
14700m/s2, 0.5ms Pulse, 5 Blows in each axis |
| Vibration, Sinusoidal |
1.2.6.8.1 |
4.4.6 |
2007/A |
100Hz-2000Hz, 196m/s2, 15 Cycles in each Axis |
| Constand Acceleration |
1.2.6.9 |
4.4.11 |
2001/A |
49000m/s2 (5000g), Y1 axis, 1 Minute |
| Fine and Gross Leak |
1.2.6.14 |
4.4.10 |
1014/A & C |
|
| Visual Inspection |
DS |
- |
|
| D3c(D) |
Salt Atmosphere |
DS |
- |
1009/A |
Test Ka |
| Fine and Gross Leak Test |
1.2.6.14 |
4.4.10 |
1014/A & C |
|
| Visual Inspection |
DS |
- |
- |
|
Post Test End Points for S/G's C3b, C3c |
- |
- |
- |
As AOb and A1 |
- |
- |
Notes
1. In these Tables, BS9400 is the referee test method; comparable methods are quoted for your guidance only.
Isocom Ltd's devices are available either as:
- Standard High Quality Product; or,
- Quality Assessed Product with release to BS9000/CECC (without High Reliability Screening); or,
- 100% Screened Product with release to BS9000/CECC for High Reliability Applications.
DEVICE
TYPE |
DETAIL
SPECIFICATION |
BS9400 Categories |
CECC20000 Categories |
| L2 |
L3 |
L4 |
UNSCR
EENED |
B |
C |
D |
UNSCR
EENED |
| 6N134 |
BS9400 GO123 |
Y |
Y |
Y |
Y |
|
| 6N140A |
BS9400 GO124 |
Y |
Y |
Y |
Y |
| 4N55 |
BS9400 GO125 |
Y |
Y |
Y |
Y |
| CS200 |
CECC20004-XXX |
|
Y |
Y |
Y |
Y |
| CS201 |
CECC20004-XXX |
Y |
Y |
Y |
Y |
| CD500 |
CECC20004-XXY |
Y |
Y |
Y |
Y |
| CD501 |
CECC20004-XXY |
Y |
Y |
Y |
Y |
| CS700 |
BS9400 GOXXX |
Y |
Y |
Y |
Y |
|
| CD750 |
BS9400 GOXXX |
Y |
Y |
Y |
Y |
| CS224 |
CECC20004-XXZ |
|
Y |
Y |
Y |
Y |
Note: Isocom Ltd's policy is to release products to CECC requirements in preference to BS9000. The BS9400G - specifications quoted above will, therefore, be superceded by CECC detail specifications when suitable generic rules documents become available within CECC.
Orders should state whether standard, quality assessed, or 100% screen product is required. As a typical ordering code example, device 4N55 would be 4N55 unscreened or non-released, but 4N55/L2 in assessment category L2.
For BS9000/CECC release orders should quote the detail specification (and issue) against which release is required, and the assessment category.
If in doubt please contact our representative or customer service department.
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